Various Positions
Micron Technology, Inc. and Micron Semiconductor Products, Inc.
BOI, ID
Full-time
Information Services / Technology (IT)
Posted on September 5, 2018
Micron Technology, Inc. and Micron Semiconductor Products, Inc. seek the following positions in Boise, Idaho:
Job Title/ Job Number
- O365 Ecosystem Engineer: 122317
- Senior Test Engineer: 122352
- Full Stack Software Engineer: 122356
- IT Database Administrator: 122359
- Advanced PCVDI Process Owner: 122360 (Note: Must be willing to travel for up to three weeks annually, domestically or internationally.)
- NAND Cell Process Integration Engineer: 122361
- Senior Treasury Analyst – Foreign Exchange: 122608
- Supply Demand Planner: 122362
- Senior Business Planning Manager: 122363
- Non-Volatile Product Engineer: 122849
- Senior Thin Films Materials Technology Engineer: 122366
- Engineer – Non-Volatile Engineering Product Engineering: 122367
- R&D Photolithography Process Development Engineer: 122370 (Note: Must be willing to travel internationally an average of 30 days a year.)
- Manager – Dry Etch – NVE: 122371 (Note: Must be available to travel internationally for 2 weeks to 2 months annually.)
- Principal Engineer – DRAM PI: 122372 (Note: Must be able to travel internationally 4 weeks a year.)
- R&D Engineer: 122928
- Senior Engineer – Dry Etch – NVM: 122373 (Note: Must be available to travel domestically and internationally for 21 days per year.)
- Sales and Logistics IT Enterprise Architect: 122408 (Note: Must be willing to travel 15 days per year domestically and internationally.)
- PQRA Engineer DRAM, Emerging Memory: 122413
- Senior Firmware Engineer: 122416(Note: Must be willing to travel 15-30 days a year, domestically and internationally.)
- SR Engineer – CMP-NVM: 122417
- CNBU New Product Introduction Lead: 122852
- IT Business Process Analyst: 122421
- Fab 4 3DxP Technology Transfer Manager: 122425 (Note: Must be able to travel domestically up to 30 days a year.)
- IT Big Data Engineer: 122427 (Note: Must be willing to travel up to two weeks a year, domestically and internationally.)
- Engineer – Dry Etch – NVM: 122429 (Note: Must be willing to travel up to 90-days a year, domestically and internationally. Will work in Boise, Idaho and Lehi, Utah.)
- CDSEM Metrology Process Development Engineer: 122850
- Senior GSC Analytics Data Modeler/Architect: 122431 (Note: Must be willing to travel up to two weeks per year, domestically and internationally.)
- Supply Chain Planner: 122524
- Engineer – NVE SSD PE: 122525
- QE PQA Param Engineer Lead: 122527
- SSD Hardware Design Engineer: 122528
- Customer Operations Manager:122530 (Note: Must have ability to travel internationally and domestically(twenty days annually).
- SSD Design Engineer: 122531 (Note: Must have ability to travel internationally and domestically 10 to 30 days a year.)
- Verification Development Engineer: 122570
- Signal Integrity Engineer: 122574
- DRAM Product Engineer: 122597
- PEE Technical Project Manager: 122934 (Note: Must be willing to travel 10 days annually domestically and internationally.)
- PEE Technical Project Manager: 122933 (Note: Must be willing to travel 10 days annually domestically and internationally.)
- CMP Equipment Development Engineer: 122598
- Data Engineer: 122599
- Principal Engineer – DRAM PI: 122603 (Note: Must be able to travel internationally for 4 weeks a year.)
- CMP Process Development Manager: 122604
All job offers will be contingent upon a successful drug screening and background check