jobs

Micron Technology, Inc. and Micron Semiconductor Products, Inc

BOI , ID
Apply Now

Ecosystem Engineer #122317, Senior Test Engineer #122352, Full Stack Software Engineer #122356

Micron Technology, Inc. and Micron Semiconductor Products, Inc
BOI, ID Full-time
Posted on September 16, 2018

Micron Technology, Inc. and Micron Semiconductor Products, Inc. seek the following positions in Boise, Idaho:

Job Title/ Job Number

  • O365 Ecosystem Engineer: 122317
  • Senior Test Engineer: 122352
  • Full Stack Software Engineer: 122356
  • IT Database Administrator: 122359
  • Advanced PCVDI Process Owner: 122360 (Note: Must be willing to travel for up to three weeks annually, domestically or internationally.)
  • NAND Cell Process Integration Engineer: 122361
  • Senior Treasury Analyst – Foreign Exchange: 122608
  • Supply Demand Planner: 122362
  • Senior Business Planning Manager: 122363
  • Non-Volatile Product Engineer: 122849
  • Senior Thin Films Materials Technology Engineer: 122366
  • Engineer – Non-Volatile Engineering Product Engineering: 122367
  • R&D Photolithography Process Development Engineer: 122370 (Note: Must be willing to travel internationally an average of 30 days a year.)
  • Manager – Dry Etch – NVE: 122371 (Note: Must be available to travel internationally for 2 weeks to 2 months annually.)
  • Principal Engineer – DRAM PI: 122372 (Note: Must be able to travel internationally 4 weeks a year.)
  • R&D Engineer: 122928
  • Senior Engineer – Dry Etch – NVM: 122373 (Note: Must be available to travel domestically and internationally for 21 days per year.)
  • Sales and Logistics IT Enterprise Architect: 122408 (Note: Must be willing to travel 15 days per year domestically and internationally.)
  • PQRA Engineer DRAM, Emerging Memory: 122413
  • Senior Firmware Engineer: 122416(Note: Must be willing to travel 15-30 days a year, domestically and internationally.)
  • SR Engineer – CMP-NVM: 122417
  • CNBU New Product Introduction Lead: 122852
  • IT Business Process Analyst: 122421
  • Fab 4 3DxP Technology Transfer Manager: 122425 (Note: Must be able to travel domestically up to 30 days a year.)
  • IT Big Data Engineer: 122427 (Note: Must be willing to travel up to two weeks a year, domestically and internationally.)
  • Engineer – Dry Etch – NVM: 122429 (Note: Must be willing to travel up to 90-days a year, domestically and internationally. Will work in Boise, Idaho and Lehi, Utah.)
  • CDSEM Metrology Process Development Engineer: 122850
  • Senior GSC Analytics Data Modeler/Architect: 122431 (Note: Must be willing to travel up to two weeks per year, domestically and internationally.)
  • Supply Chain Planner: 122524
  • Engineer – NVE SSD PE: 122525
  • QE PQA Param Engineer Lead: 122527
  • SSD Hardware Design Engineer: 122528
  • Customer Operations Manager:122530 (Note: Must have ability to travel internationally and domestically(twenty days annually).
  • SSD Design Engineer: 122531 (Note: Must have ability to travel internationally and domestically 10 to 30 days a year.)
  • Verification Development Engineer: 122570
  • Signal Integrity Engineer: 122574
  • DRAM Product Engineer: 122597
  • PEE Technical Project Manager: 122934 (Note: Must be willing to travel 10 days annually domestically and internationally.)
  • PEE Technical Project Manager: 122933 (Note: Must be willing to travel 10 days annually domestically and internationally.)
  • CMP Equipment Development Engineer: 122598
  • Data Engineer: 122599
  • Principal Engineer – DRAM PI: 122603 (Note: Must be able to travel internationally for 4 weeks a year.)
  • CMP Process Development Manager: 122604

All job offers will be contingent upon a successful drug screening and background check